The IPC-7351B LP Wizard builds CAD library parts in a few minutes with unbelievable precision. Complex parts and the numerous features of CAD libraries no longer require 30 minutes to 3 hours of work. Our software reduces time required to build CAD libraries by up to 91%!
Our LP Wizard automates the work - just take a minute to punch in the component data from the specification sheet to get a CAD-neutral library ready for any CAD format. Need to adjust the tolerance on parts already built? No problem - open 1 or 1,000 parts, modify the settings, and in a few seconds you rebuilt your entire library with the new tolerance settings! |
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The IPC-7351B 3-Tier Library System
Land patterns need an accurate Solder Joint Statistical Analysis. To help ensure that you have good solder joints regardless of what size tolerance (minimum, nominal or maximum) the components come in, use the LP Wizard. The solder joint analysis data is a must when it comes to DFA. Only the IPC-7351B LP Wizard provides you the solder joint analysis information that you need to ensure a perfect Land Pattern.
The IPC-7351B LP Wizard is in accordance with the new IPC-7351B specification. Different electronic products have different requirements for reliability, maintainability and board density. With the 3-tiered library construction concept built into the IPC-7351B LP Wizard, you can generate land patterns to meet different requirements by varying the pad and courtyard dimensions.
Three land pattern geometry variations are supplied for each of the device families; maximum land protrusion (Density Level A), median land protrusion (Density Level B) and minimum land protrusion (Density Level C). With the 3-tiered library construction concept built into the IPC-7351B Land Pattern Wizard, you can generate land patterns to meet those different requirements by varying the pad and courtyard dimensions.
Here are the three different tiers and how and when you should use them:
Density Level A: Maximum (Most) Land Protrusion
For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull- wing devices. The geometry furnished for these devices, as well as inward and “J”-formed lead contact device families, may provide a wider process window for reflow solder processes as well.
Density Level B: Median (Nominal) Land Protrusion
Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.
Density Level C: Minimum (Least) Land Protrusion
High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly. |
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